The primary telephone with a Snapdragon 888 chipset is already official with the launch of Xiaomi’s Mi 11 yesterday in China. The model new Xiaomi flagship has rapidly made its option to native tech bloggers and teardown consultants Aiao Expertise determined to take it aside and present us what it seems like on the within.
As with all teardowns this one begins by eradicating the SIM tray positioned on the underside close to the USB-C port. Then it is time to pry open the plastic eco-leather again free from all of the adhesive and take away a couple of screws holding the digital camera sensor cowl. The primary 108MP sensor is Samsung’s ISOCELL HMX which comes with OIS, it’s paired alongside a 5MP Samsung S5K5E9 whereas the 13MP ultrawide module is OmniVision’s CMOS OV13B10.
The motherboard is roofed in loads of copper foil on the back and front and likewise has a number of warmth sinks for improved thermal efficiency. After eradicating the copper bits, we are able to really see the model new Snapdragon 888 chipset alongside the flash reminiscence and each are sealed tight adhesive in case of any publicity to liquids. The four,600 mAh battery comes courtesy of Sunwoda Electronics Co Ltd.